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| z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) specification ssc-STW9Q14C rohs
z-power led x10490 technical data sheet ???? : ssc-qp-7-07-12 (rev.01) ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com features applications description ? lead frame type led pkg size: 5.6*3.0 thickness 0.75mm ? white colored smt package ? pb-free reflow soldering application ?rohscompliant ? high cri product (ra min 90) ?interior lighting ? general lighting ? indoor and out door displays ? architectural / decorative lighting STW9Q14C STW9Q14C this surface-mount led comes in standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a lead frame. the die is attached within the reflector cavity and the cavity is encapsulated by silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability. z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) [ contents ] 1. outline dimensions of STW9Q14C 2. characteristics of STW9Q14C 3. characteristic diagrams 4. color & binning 5. bin code description 7. labeling 8. packing 9. recommended solder pad 10. soldering 11. precaution for use 12. handling of silicone resin leds z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 1. outline dimensions of STW9Q14C notes : [1] all dimensions are in millimeters. [ 2 ] scal e : n o ne [3 ] un de fin e d t o le r a nce is 0. 1mm [ 4 ] th e led pa ckage h a s two ca thode mar k s. *[1] anode cathode 2 1 esd protection device cathode mark top view bottom view side view circuit *[1] a c n.c n.c slug z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) material structure parts no. name description materials lead frame metal copper alloy (silver plated) chip source blue led gan on sapphire wire metal gold wire encapsulation silicone +phosphor body thermo plastic heat-resistant polymer zener diode si - z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 3. characteristics of STW9Q14C 1) electro-optical characteristics at 100ma 2) absolute maximum ratings parameter symbol value unit forward current i f 160 ma power dissipation* [1] p d 560 mw junction temperature t j 125 oc operating temperature t opr -40 ~ +85 oc storage temperature t stg -40 ~ +100 oc esd (hbm) 5,000v hbm v parameter symbol value unit min typ max forward voltage v f 2.9 - 3.4 v reverse voltage v r - 0.9 1.2 v luminous intensity* [1] (2,600~4,200 k) i v - 10.2 (30.9) - cd (lm) correlated color temperature cct 2,600 - 4,200 k viewing angle [2] 2 1/2 - 120 - - color rendering index* ra 90 - 100 - thermal resistance [3] r th js - 18 - oc/w (ta=25 , rh30%) *n ote s : led?s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. [1] care is to be taken that power dissipation do es not exceed the absolute maximum rating of the product. *n ote s : a l l meas ur e m ent s wer e made u n d e r the standar d i z ed e n vi ro nm ent of ssc. [1] the luminous intensity iv was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the led package. [2] 2 1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [3] thermal resistance: rthjs (junction / solder) * tolerance : vf : 0.1v, iv : 7%, ra : 2, x,y : 0.007 z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 1) spectrum data (if=100ma, ta=25 , rh30%) 4. characteristic diagrams 300 400 500 600 700 800 0.0 0.5 1.0 relative emission intensity wavelength [nm] z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 3) forward current vs. relativ e luminous intensity, ta=25 2) forward voltage vs. forward current, ta=25 0 20 40 60 80 100 120 140 160 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 relative luminous intensity forward current i f [ma] 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 0.00 0.05 0.10 0.15 if[a] vf[v] z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 4) chromaticity coordinate vs. forward current, ta=25 (2600~3200k) 0.4490 0.4495 0.4500 0.4505 0.4510 0.4515 0.4520 0.4525 0.4530 0.400 0.401 0.402 0.403 0.404 0.405 0.406 0.407 0.408 20ma 60ma 80ma 100ma 120ma 160ma y x z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 5) relative luminous intensity vs . junction temperature, if=100ma 6) chromaticity coordinate vs . junction temperature, ta=25 0.437 0.438 0.439 0.440 0.441 0.442 0.385 0.390 0.395 0.400 0.405 25 40 60 80 100 120 y x 30 45 60 75 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous intensity junction temperature tj( o c) z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 7) ambient temperature vs. allo wable forward current, if=100ma 30 45 60 75 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 relative forward voltage junction temperature tj( o c) 8) ambient temperature vs. maximum forward current -40-20 0 20406080100 0 20 40 60 80 100 120 140 160 180 200 forward current i f [ma] am bient tem perature ta( o c) rth j-a =100 o c/w z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 9) viewing angle, ta=25 -90 -60 -30 90 60 30 0 z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 2600k 2700k 2900k 3000k 3200k 3500k 3700k 4000k 4200k cie x cie y f0 f1 f2 f3 f4 f5 g0 g1 g2 g3 g4 g5 h0 h1 h2 h3 h4 h5 e0 e1 e2 e3 e4 e5 5. color & binning 0.42 0.44 0.46 0.48 0.38 0.40 0.42 0.44 2700k 2600k h12 g42 g11 g21 cie y 2900k 3000k 3200k cie x g41 g31 g22 g32 g12 g43 g23 g33 g13 g44 g24 g34 g14 h42 h11 h21 h41 h31 h22 h32 h43 h23 h33 h13 h44 h24 h34 h14 macadam macadam 3 3 - - step rank step rank * measurement uncertainty of the color coordinates : 0.007 0.42 0.44 0.46 0.48 0.38 0.40 0.42 0.44 2700k 2600k h12 g42 g11 g21 cie y 2900k 3000k 3200k cie x g41 g31 g22 g32 g12 g43 g23 g33 g13 g44 g24 g34 g14 h42 h11 h21 h41 h31 h22 h32 h43 h23 h33 h13 h44 h24 h34 h14 z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) color rank z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) color rank z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) color rank z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 6. bin code description bin code luminous intensity [mcd] color rank forward voltage [v] s0 e1 z1 2,600k ~ 4,200k 2,600k ~ 4,200k color rank @ i f = 100ma e~h forward voltage [v] @ i f = 100ma rank min. max. y3 2.9 3.0 z1 3.0 3.1 z2 3.1 3.2 z3 3.2 3.3 a1 3.3 3.4 luminous intensity [mcd] * [1] @ i f = 100ma flux * [2] [lm] rank min. max. typ. s0 9000 10000 29.5 t0 10000 11000 31.8 u0 11000 11700 33.5 available ranks not yet available ranks cct cie iv rank 3700~4200k e so t0 u0 3200~3700k f so t0 u0 2900~3200k g so t0 u0 2600~2900k h so t0 u0 *notes : all measurements were made under the standardized environment of ssc. [1] ssc sort the led package according to the luminous intensity iv. [2] the lumen table is only for reference. z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 7. labeling # 1 # 2 # 3 - #1 : luminous intensity : iv [mcd] - #2 : color coordinates : x, y - #3 : forward voltage : v f [v] rank x 1 x 2 -x 3 x 4 -x 5 -x 6 x 7 -x 8 full code form : -x 1 : company -x 2 : kind of led -x 3 x 4 : cri group -x 5 : package series -x 6 x 7 : characteristic code -x 8 : version z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 8. packing 1 side outer box structure material : paper(sw3b(b)) ? ? ? humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. type size (mm) ? ? ? 7inch 245 220 102 245 220 142 z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 180 2 13 22 60 15.41.0 130.3 ( tolerance: 0.2, unit: mm ) 1)quantity : 3500pcs/reel 2)cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm 3)adhesion strength of cover tape : adhesion st rength to be 0.1-0.7n when the cover tape is turned off from the carrier tape at the angle of 10 ? to the carrier tape. 4)package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package. 8. packing z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 9. recommended solder pad notes : [1] all dimensions are in millimeters. [ 2 ] scal e : n o ne [3 ] un de fin e d t o le r a nce is 0. 1mm t h is d r a w in g wit h ou t t o ler a nces a r e fo r r e fe re nc e o n ly. z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) 22 22 10. soldering * caution 1. re flow solderin g is recommen d ed no t to be do n e mor e than two times . in the case of more than 24 hours pass ed soldering after first, leds will be damaged. 2. repai r s s h o u l d n o t be d o ne after the led s have b e e n s o l d er e d . when r e p a ir is un a v o i d a b l e , s u it a b le t o o l s mu s t b e use d . 3. di e slu g i s to be so l d e r e d . 4. when s o l d eri n g, do not put stre s s o n the leds d u ri n g heati n g. 5. after s o l d eri n g, do n o t warp the ci r c ui t boar d. ipc/jedec j-std-020 profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat -temperature min (tsmin) -temperature max (tsmax) - time (tsmin to tsmax) (ts) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: -temperature (tl) -time (tl) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature (tp) 215 260 time within 5 c of actual peak temperature (tp)2 10-30 seconds 20-40 seconds ramp-down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) (1) storage to avoid the moisture penetration, we recommend store in a dry box with a desiccant . the recommended storage temperature range is 5c to 30c and a maximum humidity of rh50%. (2) use precaution after opening the packaging use proper smd techniques when the led is to be soldered dipped as separation of the lens may affect the light output efficiency. pay attention to the following: a. recommend conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than rh30% b. if the package has been opened more than 4 week(msl_2a) or the color of the desiccant changes, components should be dried for 10-12hr at 60 5 (3) do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) do not rapidly cool device after soldering. (5) components should not be mounted on warped (non coplanar) portion of pcb. (6) radioactive exposure is not considered for the products listed here in. (7) gallium arsenide is used in some of the products listed in this publication. these products are dangerous if they are burned or shredded in the process of disposal. it is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) this device should not be us ed in any type of fluid such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) should be used. (9) when the leds are in operation the maximum current should be decided after measuring the package temperature. (10) leds must be stored properly to maintain the device. if the leds are stored for 3 months or more after being shipped from ssc, a sealed container with a nitrogen atmosphere should be used for storage. (11) the appearance and specifications of the product may be modified for improvement without notice. (12) long time exposure of sunlight or occasi onal uv exposure will cause lens discoloration. (13) vocs (volatile organic comp ounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of leds and discolor when exposed to heat and photonic energy. the result can be a signif icant loss of light output from the fixture. knowledge of the properties of the materials select ed to be used in the construction of fixtures can help prevent these issues. (14)attaching leds, do not use adhesives that outgas organic vapor. (15)the driving circuit must be designed to allow forward voltage only when it is on or off. if the reverse voltage is applied to led, migration can be generated resulting in led damage. 11. precaution for use z-power led x10490 z-power led x10490 technical data sheet ssc ssc - - STW9Q14C STW9Q14C august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com ???? : ssc-qp-7-07-12 (rev.01) (1) during processing, mechanical stress on the surface should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can also become scratched. (3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pre ssure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the led?s reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the handling of such devices. compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) ssc suggests using isopropyl alcohol for cleaning. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. (6) please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. 12. handling of silicone resin leds |
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